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MECHANICAL PROPERTIES OF LEAD FREE SOLDER ALLOY FOR GREEN ELECTRONICS UNDER HIGH STRAIN RATE AND THERMAL AGING

Journal:Journal of Engineering and Applied Sciences (JEAS), 2017, Volume 36, Issue No 1

Author(s): Muhammad Amir

Keyword(s): Lead free solder, Intermetallic compound particles, Thermal aging, Strain rate, Mechanical Properties

Category

SOCIAL AND CULTURAL STUDIES
ENGINEERING AND TECHNOLOGY

Year

2015 or earlier
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